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MC2 is pleased to announce the release of No-Stress heat spreaders: heat spreading substrates with tailorable thermal expansion properties. No-Stress heat spreaders offer a unique combination of:

  • High Thermal Conductivity
  • Low Thermal Expansion
  • Affordability
  • Easy Machining & Attachment

Unlike aluminum and copper substrates, No-Stress spreaders make it easy to use high conductivity hard bonds between low expansion semiconductor or ceramic materials and the heat spreading substrate - without creating excessive residual stresses in the semiconductor material. Compared to the other leading high conductivity/low thermal expansion materials shown in the table, the No-Stress heat spreaders are tailorable over a broader range, while simultaneously offering greater ease of use and lower costs.

Heat Spreader Substrate CTE
(x 10^-6/K)
k
(W/m/K)
Kovar 5.3 17
W/Cu 6.7 - 8.0 185 - 210
Mo/Cu 7 - 8 160 - 170
AlSiC 6.4 - 7.3 160 - 180
No-STRESS 5 - 12 100 - 250

Performance

The thermal performance of the No-Stress heat spreaders is shown in the graph below. The No-Stress material spreads heat in two dimensions: a laser diode would typically be mounted on the edge of the spreader, and the waste heat would be dissipated away from the edge. The heat is spread in the plane normal to the long axis of the diode. In this configuration, the spreader provides approximately ½ the thermal conductivity of copper, with a thermal expansion of 9 x 10-6/K.

Options

The No-Stress heat spreaders can be fabricated in a variety of design configuration and sizes to extremely high tolerances. The matched expansion material can be integrated into conventional copper heat spreaders to optimize thermal performance. They are available with copper or gold plating and with user-specified surface finish. The No-Stress attributes can also be integrated into MC2's air-cooled and liquid-cooled heatsinks for enhanced thermal performance.

Availability

Now available in evaluation quantities. Larger quantities and custom designs can be built to order.

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